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Laser Light Technologies, Inc. employs a variety of laser cutting systems working in wavelengths across the entire spectrum, and will partner with you to integrate our manufacturing process into your production line. Our expert staff, with extensive experience covering a wide breadth of Laser Cutting – Slotted Washer materials and substrates, will ensure your laser cutting application meets your precise specifications and tolerances.

Applications:

We have comprehensive expertise in laser cutting, including applications such as dicing and re-shaping semiconductor wafers, cutting metal and polymer stents (bio-absorbable), washers, gears, gaskets, stencils, shadow masks out of flat sheets, and tubing. Additionally, we specialize in cutting flat or 2D ceramic and nitinol parts for use as components and IC substrates.

Materials:

With our laser cutter equipment, we can produce custom parts (hole, slots, and curved patterns) made from tubes or shim stock materials.  Our experience also includes working with metals such as steel (tool steel, SS, Haste alloy), aluminum, nitinol, magnesium, copper, brass, gold, platinum, tungsten, titanium, tantalum, and molybdenum.  Other material candidates for laser cutting include polymers, acrylic, polyimides, ceramic, sapphire, diamond, graphite, semiconductor wafers, and plastics.

Don’t see the material you need cut?

Our engineers and technicians will work with you to determine or develop the right laser cutter solution for your application.  We are currently in the process of upgrading our facility with a 3kW flat sheet laser cutter, which will extend the services we can offer to you.

Specifications and Tolerances:

Our systems can produce kerf widths below the 10 um level, leaving clean edges and extremely fine cuts.  Typically, we use motion systems that feature working areas up to 18” x 24” with absolute positional accuracy to better than +/- .001″ within the working area.  If you require a larger working area or more stringent tolerances for your application, our dedicated engineering and technical staff will develop a solution to fit your requirements and specifications.

We offer the following laser cutting capabilities for your project:

  • Metal and polymer stents (bio-absorbable)
  • Washers
  • Gears
  • Gaskets
  • Stencils
  • Shadow masks out of flat sheets
  • Tubing
  • Flat or 2D ceramic
  • Dicing and re-shaping semiconductor wafers
  • Custom parts (hole, slots and curved patterns)

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