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Our engineers and staff have worked extensively with ceramic materials with amazing results.  Using state-of-the-art laser systems, we have developed processes that allow us to machine precise features without cosmetic defects such as microcracks or heat affected zones.  When cutting or dicing ceramic wafers, we achieve extremely high edge quality without raised edges or chipping along the cut.

We have the expertise to micromachine the following:

  • 96% Alumina
  • 5% Alumina
  • Aluminum Nitride
  • Boron Nitride
  • PZT
  • Silicon Carbide
  • Silicon Nitride
  • Titanium Oxide
  • Tungsten Carbide
  • Zirconia

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