The semiconductor industry demands precision in every respect. So whether we are dicing wafers or marking wafer substrates, we take the utmost care to ensure that quality comes first. Utilizing our vision systems, we accurately position and align the wafer before machining. Our versatile motion stages and precision laser systems are capable of extremely precise placement of even the smallest features.
In dicing, kerf widths of less than 10um are possible, allowing for more usable surface area on the wafer and a higher volume of chips.
We have the expertise to micromachine the following: