Wire stripping remove sections of insulation or shielding from wires and cables to provide electrical contact points for termination.
Laser wire stripping is a fast process that provides excellent precision and process control and eliminates contact with the wire, allowing for the processing of delicate wire gauges greater than 32 AWG.
With the right combination of laser type, wavelength, and beam shaping, insulation can be ablated with no damage to the wire, and without leaving a residue.
Unlike conventional methods, virtually all insulation types can be removed with laser wire stripping. Because we can precisely program the beam pattern, a variety of cable cross-sections can be stripped, including O-, T-, H-shaped wires that cannot be stripped with mechanical or thermal processes.
The type of laser used (for example, excimer or femtosecond) and the pulse rate are determined by the material to be removed.
Our laser systems allow us to process a variety of wire and cable shapes and sizes, up to 40 AWG (0.00314 inches in diameter). Stripping can be programmed to ablate insulation at any point along the wire, enabling high-precision mid-span removals.
As microelectronics and life-sciences/medical devices and instrumentation become smaller and more complex, with advanced materials and “smart” applications, wire stripping must achieve precise specifications and tight tolerances for top performance. Applications include:
A global, top-tier tubing manufacturer recently teamed up with Laser Light Technologies to remove, through laser ablation, coatings from extremely fine wire for a tubing application. The company produces innovative, high-performance medical and surgical tubing from a variety of materials, which provide superior mechanical, thermal, and chemical properties with tighter tolerances compared to conventionally extruded plastic tubing.
When its previous vendor could not keep up with its production demands, the company partnered with Laser Light Technologies to perform high-precision removal of insulative coating from small wires > 0.0095 inches in diameter. To meet production requirements, the Laser Light engineering team built a customized, automated system to advance wire with sub -0.01-inch accuracy, laser-ablate the material to be removed, and perform quality checks, all while improving quality, shortening time to market, and reducing overall production costs.
Laser Light Technologies has more than 30 years of experience laser-manufacturing high-precision products for the medical device, life sciences, and microelectronics industries. As a result, customers partner with us for unparalleled responsiveness, expert knowledge, exceptional product quality and guaranteed performance.
Our highly experienced engineers, technicians, and staff can wire-strip virtually any type of insulation or shielding to meet your most challenging production or assembly needs—including complex wire geometries for miniaturized components. We can also build customized wire-stripping systems for in-house use when needed. Contact us today at 800-459-4455 or firstname.lastname@example.org.